PaCaPa
Table of Contents
For more information, check the first author’s website.
About #
We present PaCaPa, a handheld device that renders haptics on a user’s palm when the user interacts with virtual objects using virtual tools such as a stick. PaCaPa is a cuboid device with two wings that open and close. As the user’s stick makes contact with a virtual object, the wings open by a specific degree to dynamically change the pressure on the palm and fingers. The open angle of the wings is calculated from the angle between the virtual stick and hand direction. As the stick bites into the target object, a large force is generated.
Renderbility of Size, Shape, and Stiffness #
Our device enables three kinds of renderings: size, shape, and stiffness. We conducted user studies to evaluate the performance of our device. Results from our studies validate that PaCaPa can render relative size, and participants can distinguish between basic shapes, and soft and hard objects.
Applications #
Top in the video below is a Whack-a-mole application that highlights stiffness and shape. When a user wields the stick in the same direction, the specific angle is presented when the soft or hard mole is hit.
Bottom in the video below is a Katana-Cutting application that highlights size and consecutive touching. Rolls of straw of various sizes can be cut using a virtual Katana.
Publications #
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Yuqian Sun, Shigeo Yoshida, Takuji Narumi, and Michitaka Hirose. 2019. PaCaPa: A Handheld VR Device for Rendering Size, Shape, and Stiffness of Virtual Objects in Tool-based Interactions. In Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems (CHI ’19). Association for Computing Machinery, New York, NY, USA, Paper 452, 1–12. https://doi.org/10.1145/3290605.3300682
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Yuqian Sun, Shigeo Yoshida, Takuji Narumi, and Michitaka Hirose. 2018. Handheld Haptic Interface for Rendering Size, Shape, and Stiffness of Virtual Objects. In Proceedings of the 2018 ACM International Conference on Interactive Surfaces and Spaces (ISS ’18). Association for Computing Machinery, New York, NY, USA, 411–414. https://doi.org/10.1145/3279778.3281759 Best Demo Award
Awards and Honors #
- ACM ISS 2018 Best Demo Award, 28 Nov. 2018.